| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB Material: Fr4;
Layer: 1;
Impedance Control: No;
Buried& Blind Vias: No;
Copper: 35um;
Hard Gold: N/a;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Finished Thickness: 0.2-4mm;
Minimum Solder Resist Bridge: 0.1mm;
Minimum Linewidth: 0.075mm;
Supplier Type: PCBA;
Type: Smart Electronics PCBA;
Mounting Component Pitch: 0.15mm;
Minimum Hole Diameter: 0.15mm;
Accuracy of Printing Solder Paste: 0.025mm;
Minimum Linespacing: 0.075mm;
Repeated Accuracy: 0.01mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr-4fr-1,Cem-1,Cem-3fr-4 Halogen Free;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Solder Mask Color: Green, Yellow, Black, White, Red, Blue;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
Profiling: Punching, Routing, V-Cut, Golden Finger, Beveling;
Copper Thickness: 1oz or Custom;
Layer: 1-24;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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