Mr. Lismilefen
Address:
Wuhan Guanggu, Wuhan, Hubei, China
Telephone:
Zip Code:
Fax:
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Account Registered in:
2018
Business Range:
Electrical & Electronics
Business Type:
Manufacturer/Factory
Company Introduction
Production Capacity
15 years PCB manufacture experience, we can handle 99% PCB
Layer from 1 to 60 lays high tg HASL lead free anic solderability preservatives Hard Gold; Electroplate gold Immersion gold; Enig Immersion silver; Chemical silver; Chem. AG; Electroless silver Flash gold Immersion Sn; Chem. Sn; Immersion tin; Electroless sn Tin plating Carbon Ink Peelable Mask OSP Plating gold Immersion gold selective ...
Layer from 1 to 60 lays high tg HASL lead free anic solderability preservatives Hard Gold; Electroplate gold Immersion gold; Enig Immersion silver; Chemical silver; Chem. AG; Electroless silver Flash gold Immersion Sn; Chem. Sn; Immersion tin; Electroless sn Tin plating Carbon Ink Peelable Mask OSP Plating gold Immersion gold selective ...
15 years PCB manufacture experience, we can handle 99% PCB
Layer from 1 to 60 lays high tg HASL lead free anic solderability preservatives Hard Gold; Electroplate gold Immersion gold; Enig Immersion silver; Chemical silver; Chem. AG; Electroless silver Flash gold Immersion Sn; Chem. Sn; Immersion tin; Electroless sn Tin plating Carbon Ink Peelable Mask OSP Plating gold Immersion gold selective Immersion silver Immersion Sn Gold Finger Press -fit hole Half hole Sink hole Electroplate filled via Edge plating Silver filled vias Resin filled vias HTE copper Coper inhole wall Unbalance Copper Conductive epoxy Impedance controle Depth Control Routing Depth Control Drilling Halogen free Via tenting Unbalance Build Stiffener Mixed Board Routing eyeballing Universal Grid Dedicated Flying Probe Test Outline Drill Size Impedance Finished Board Thickness BAG Pad Warpage Material PCB/Sheet utilization Pannel/Sheet utilization Array
Layer from 1 to 60 lays high tg HASL lead free anic solderability preservatives Hard Gold; Electroplate gold Immersion gold; Enig Immersion silver; Chemical silver; Chem. AG; Electroless silver Flash gold Immersion Sn; Chem. Sn; Immersion tin; Electroless sn Tin plating Carbon Ink Peelable Mask OSP Plating gold Immersion gold selective Immersion silver Immersion Sn Gold Finger Press -fit hole Half hole Sink hole Electroplate filled via Edge plating Silver filled vias Resin filled vias HTE copper Coper inhole wall Unbalance Copper Conductive epoxy Impedance controle Depth Control Routing Depth Control Drilling Halogen free Via tenting Unbalance Build Stiffener Mixed Board Routing eyeballing Universal Grid Dedicated Flying Probe Test Outline Drill Size Impedance Finished Board Thickness BAG Pad Warpage Material PCB/Sheet utilization Pannel/Sheet utilization Array
Factory Address:
Wuhan Guanggu, Wuhan, Hubei, China