Guobiao New Materials, and adopts the CIDM model along with international ESG standards,

Focused on the development of semiconductor wafer processes and chip processes; The company is the first in the world to achieve six major crystal

Round substrate through-hole (TPV/TSV/TSICV/TGV/TCV/GB-TSCDV) process and generation

The company is an industrial enterprise and one of the six major wafer suppliers; Its process technology has broken through bottlenecks

Moreover, the product can achieve domestic production and import substitution, meeting the requirements of aviation, electronics, instrumentation, and military industries

Demand.

The company's overseas team, primarily composed of members from Taiwan, Japan, and South Korea, consists of over 20 people, with 6 full-time sales staff from mainland China, particularly in the field of craftsmanship

Material engineers, equipment and production technicians have over 15 years of experience in their respective fields, among them

Doctors account for 60%; Company in

TPV/TSV/TSICV/TGV/TSCDV/TAMBV/ALD/CMP/BCD/ECP/RDL/

GAAFET/FinFET/LDD/DDD/SOI/SIP/HBM/CPO/STI/3D-4D heterogeneous integration

Process technologies such as forming, bonding, etching, electroplating, deposition coating, wafer metallization, wafer back-gold, and masking

Leading internationally, achieving nanoscale precision, and featuring globally unique GB-TSCDV/TSCDBV

Process technology; Companies and related research institutes, domestic universities, domestic research institutes, overseas institutions

Large enterprises in overseas industries and related sectors have established extensive cooperation and business relationships. Company in

Conductor automotive chips, quantum chips, AI chips, and others are being developed to facilitate the industrialization of BAT-AI.