| Specification |
Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Taonic;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Insulation Resin: Epoxy Resin;
Min. Hole Size: 1.0mm5%);
Hole Spacing: 2.54mm;
Board Size: Please Contact Us;
Board Thickness: 1.6mm;
Surface Finishing: Double Sided Tin Spraying;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1.Cem-1,Cem-3,Fr-4halogenfree;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Selling Units: Single Item;
Color: Greenyellow, Black, White, Red, Blue;
Copper Thickness: 0.5oz1.0oz2oz3oz or Custom;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Supplier Type: Manufacturer;
Application: Consumer Electronics;
Board Thickness: 0.2mm-4mm;
Surface Finishing: HASL, Lead Free HASL, Imm Gold, OSP;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Smart;
Insulation Resin: Epoxy Resin;
Single Gross Weight: Kg;
Copper Thickness: Standard;
Min. Hole Size: 1.0mm5%);
Single Package Size: Xxcm;
Min.Line Spacing: Standard;
Hole Spacing: 2.54mm;
Board Size: Please Contact Us;
Min.Line Width: Standard;
Board Thickness: 1.6mm;
Surface Finishing: Double Sided Tin Spraying;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Selling Units: Single Item;
Insulation Resin: Epoxy Resin;
Copper Thickness: Standard;
Min.Hole Size: 1.0mm5%;
Min. Hole Size: 1.0mm(5%);
Min. Line Spacing: Standard;
Hole Spacing: 2.54mm;
Board Size: Please Contact Us;
Min.Line Width: Standard;
Board Thickness: 1.6mm;
Surface Finishing: Double Sided Tin Spraying;
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