| Specification |
Layers: Multilayer;
Customized: Customized;
Condition: New;
Product Name: Circuit Board PCBA;
Motherboard Weight: 300g;
Operating Voltage: 90-265 VAC(Single Phase);
Cooling Method: Natural Cooling;
Communication Method: Bluetooth/WiFi/4G/Reader;
Undervoltage Protection: 85V;
Inner Vacuum Packing: OEM, ODM;
Turnkey Assembly PCB Service: Other Capabilities;
Installation: Vertical/Wall-Mounted;
Overpressure Protection: 270V;
Operating Current: 50A;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-40 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Outline Tolerance: +0.10mm;
Minimum Line/ Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Metal Coating: Cast Iron;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
PCB Size: 340*360mm;
Platform Number: Double;
Cutting Spindle: China Brand;
Rotational Speed of The Main Shaft: Max 60000rpm;
PCB Thickness: 0.3~3.0mm;
Ion Air Gun: ≤±15V;
Cut Precision: ± 0.05mm;
Voltage: 220V, 50/60Hz;
Dimensions: 1180*1180*1350mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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