SUN KING (Hong Kong) LIMITED is a high-tech semiconductor company, which develops small home appliances, toys, gifts such as intelligence solutions and manufacture professional SMT / DIP electronic products.

SUN KING (Hong Kong) LIMITED has general taxpayer qualification, long-term cooperate with the local Shenzhen, the mainland company (factory) as well as overseas famous enterprises, and accumulated a lot of good experience and countless successful stories.

SUN KING (Hong Kong) LIMITED is now the main representative agent of the IC brands from Europe, America, Japan, Taiwan and mainland China, operating more than 20 product lines such as: Yomband, Airtac, Sonix, Lontiumsemi, Chipown, Siyom, Bencent, Semitech, Jinke, Microchip, Holtek, TI, NTK, Superchip, ABOV, NXP and etc.

At present, the company planning towards two aspects, one is to continue to strengthen high-tech R & D team to provide customers with products, project development, design and other services, SUN KING has achieved mature program in the field of intelligent technology;

1: The large field of home appliances: Air conditioners, washing machines, refrigerators, computer embroidery machine such as main control panel.

2: The small household appliances: Hair curlers, hair straighteners, hair clippers, shavers, toasters, electric iron, air conditioning, remote control, blender, soybean, milk machine, microwave oven, water heater, electric oven and so on.

3: Toy areas: Remote control cars, various types of electronic sound toys, etc.

4: Gifts areas: Electronic massage, calendar, clocks, hygrometer, children monitor, etc.

5: HDMI areas: Splitters, converters, switches, etc.

6: RFID UHF total solution.

On the other hand, based on ISO9001: 2000 management system and the standard business operations, SUN KING continuously improves the quality of SMT / DIP electronic product to achieve industry-leading level.

1) All modern lead-free process in the operation, refused to lead operations to ensure that the green of the production line.

2) The placement equipment of chip component is a Japanese card YAMAHA and SANYO high-speed placement machine, can mount range for 0201 and above SMD components, SMD precision to achieve CHIP +/-0.1M/M.

3) The placement of the IC can handle all types of packaging integrated circuits, including SO, SOP, SOJ, TSOP, TSSOP, QFP, TOFP, PLCC, QFN, BGA, GFP package components accuracy up to +/-0.08M/M, BGA package components feet distance in 0.254M/M or above both can automatically mount.

4) Inserted by hand, can handle a board width 50M/M-450M/M range, workers skilled and refined.

Our Aims are as follows: Teamwork, integrity, loyalty and innovation.